dr. Romina Sattari

1. Multi-domain reliability monitoring of semiconductor packaging in harsh environments
   Romina Sattari;
   PhD thesis, Delft University of Technology, 2025.

2. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
   R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
   Applied Thermal Engineering,
   Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

3. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
   Romina Sattari; Henk van Zeijl; GuoQi Zhang;
   In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2023. DOI: 10.1109/EuroSimE56861.2023.10100771

4. A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
   Romina Sattari; Henk van Zeijl; GuoQi Zhang;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

5. In-situ reliability monitoring of power packages using a Thermal Test Chip
   H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
   In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2022. DOI: 10.1109/EuroSimE54907.2022.9758913

6. Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
   R. Sattari; H. van Zeijl; GuoQi Zhang;
   In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
   2021. DOI: 10.23919/EMPC53418.2021.9584984

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