Romina Sattari

1. An In-package EMC based Relative Humidity Sensor
   R. Sattari; H. Van Zeijl; Z.Y. Chang; G.Q. Zhang;
   IEEE Sensors Journal,
   2025. DOI: 10.1109/JSEN.2025.3571230

2. Multi-domain reliability monitoring of semiconductor packaging in harsh environments
   Romina Sattari;
   PhD thesis, Delft University of Technology, 2025.

3. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip
   R. Sattari; Dong Hu; Xu Liu; H. van Zeijl; S. Vollebregt; GuoQi Zhang;
   Applied Thermal Engineering,
   Volume 221, pp. 119503, 2023. DOI: 10.1016/j.applthermaleng.2022.119503

4. Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC Sensors
   R. Sattari; H. van Zeijl; G. Zhang,;
   24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
   pp. 1-3, 2023. DOI: 10.23919/EMPC55870.2023.10418435

5. Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials
   R. Sattari; H. van Zeijl; G. Zhang;
   IEEE 25th Electronics Packaging Technology Conference (EPTC),
   pp. 588-591, 2023. DOI: 10.1109/EPTC59621.2023.10457675

6. Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages
   Romina Sattari; Henk van Zeijl; GuoQi Zhang;
   In 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2023. DOI: 10.1109/EuroSimE56861.2023.10100771

7. A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
   Romina Sattari; Henk van Zeijl; GuoQi Zhang;
   In Proc. of Electronic Components and Technology Conference (ECTC),
   2023.

8. In-situ reliability monitoring of power packages using a Thermal Test Chip
   H. A. Martin; R. Sattari; E. C. P. Smits; H. W. van Zeijl; W. D. van Driel; GuoQi Zhang;
   In 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
   2022. DOI: 10.1109/EuroSimE54907.2022.9758913

9. Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip
   R. Sattari; H. van Zeijl; GuoQi Zhang;
   In 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
   2021. DOI: 10.23919/EMPC53418.2021.9584984

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