Department of Microelectronics
Faculty of Electrical Engineering, Mathematics, and Computer Science

Ahmed Abdelwahab

Publications

  1. Pick-and-Release: a Novel Contactless Bonding Method for Die Attachment
    A. Abdelwahab; H. van Zeijl; R. van Hoorn; H. Kuipers; M. Mastrangeli;
    In IEEE 75th Electronic Components and Technology Conference (ECTC),
    2025. DOI: 10.1109/ECTC51687.2025.00363

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